Description:

Demand for reliable electronics products has increased greatly in recent years. The Espec TSB liquid-to-liquid thermal shock chamber series is a solution to enable highly accurate reliability testing of electronic components. This shock chamber creates a higher thermal stress than a standard air-to-air thermal shock chamber would do. The liquid (Galden DO2-TS) used in the test room ensures faster heat transfer to the product. This also enables test results to be achieved more quickly.

Technical specifications