Espec Liquid-to-Liquid Thermal Shock Chamber


Demand for reliable electronics products has increased greatly in recent years. The Espec TSB liquid-to-liquid thermal shock chamber series is a solution to enable highly accurate reliability testing of electronic components. This shock chamber creates a higher thermal stress than a standard air-to-air thermal shock chamber would do. The liquid (Galden DO2-TS) used in the test room ensures faster heat transfer to the product. This also enables test results to be achieved more quickly.

Technical specifications

  • Capacity:
    High temp. exposure range:
    Low temp. exposure range:
    Temperature fluctuation:
    Specimen transfer time:
    Power supply:
  • 2,16 or 4,5 litre
    +70°C to +200°C
    -65°C to 0°C
    ± 2,0°C
    Within 10 seconds
    Touchscreen program controller


  • • User friendly touchscreen controller
    • Very high thermal stress
    • Energy efficient system
    • Smooth transfer between temperature baths

Some options:

  • • External alarm terminals
    • Paperless recorder
    • RS-485 or RS-232 interface
    • Mobile installation (casters and leveling feet)


  • • Automotive
    • Aerospace
    • Communication
    • Defense
    • Electronics / semiconductor


  • • Thermal shock testing